The silicon-based integrated passive devices market dominated with CAGR of 10.3%. Silicon-based IPDs provide excellent insulation, a low thermal coefficient, and better device performance. In compared to traditional IC technology, the performance of integrated passive devices may be increased further by integrating a thick metal and dielectric layer to produce high capacitance density. The silicon-based integrated passive devices may be ground to a thickness of 100 micrometres using a variety of packaging techniques such as wire bonding, micro bumping, and copper pads. Glass base is favoured among non-silicon-based varieties due to benefits such as high resistivity and minimal RF coupling to electronics. Glass wafers do not heat up as much as other materials during the production process. Additionally, 5G technology is expected to be rolled out in the United States, Japan, South Korea, United Kingdom, Germany, and China by 2021, which is expected to contribute to the growth of the embedded passive device market. in the years to come.
Manufacturers in the passive embedded device market have a large platform from which they can meet the entire demand for passive embedded devices. Global sales of passive embedded devices are experiencing increased competition. With increasing competition, new competitors are offering a variety of options at reasonable prices, meeting the demand for more accessible passive integrated devices for customers.
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What are the factors limiting the Integrated Passive Devices market growth?
The high cost of embedded passive devices compared to discrete components is limiting the growth of the embedded passive device market as well as the embedded passive device sales and the demand for embedded passive devices.
The long-term impact should be minimal, as leading companies in this industry strive to minimize the cost of integrated passive devices.
Low cost production is key to maximizing profits. Traditional printed circuit boards, on the other hand, are standardized for individual discrete components, but not for integrated passive devices. When traditional PCBs are combined with integrated passive devices, they incur additional costs. The cost ratio of a single discrete component to integrated passive devices (1.5 X 1.5) is one and one third. This is mainly due to the commoditization and widespread use of discrete components.
Key segments covered by the Built-in passive devices Industry survey
- By passive devices
- Baluns
- Filtered
- Couplers
- Diplexers
- Custom IPDs
- Others
- By request
- ESD/EMI
- IPD RF
- Digital and mixed signals
- Others
- By wireless technology
- Wireless
- Bluetooth
- Cellular
- GPS
- Others
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Recent Developments in the Embedded Passive Devices Market
- TDK Corporation launched a new line of EPCOS power capacitors for DC link applications in May 2021. The new capacitors are offered with voltage ratings ranging from 700 V DC to 2000 V DC and capacities ranging from 20 F to 270 f.
- Vishay Intertechnology released a new automotive-grade through-hole inductor with 420A saturation current and 30% inductance decrease in a 1500 package in March 2021. The IHXL-1500VZ-5A offers extremely low typical DCR of 0.12 m and a continuous high -temperature operation up to +155°C for automotive applications.
- Panasonic announced in January 2021 the EEH-ZK(U) series hybrid conductive polymer SMD electrolytic capacitors, which combine the advantages of electrolytic capacitors with solid polymer capacitors. High temperature tolerance and compact packages are available.
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The key players in the Sales of integrated passive devices Market
● Consumer electronics segment dominated the market and held the largest market share of 21.7% in 2020. Based on industry verticals, the global passive embedded device market is segmented into consumer electronics, automotive, aerospace and defense, telecommunications, medical and healthcare, and others.
● Rising usage of these components in different consumer electronics such as laptops, smartphones, wearable devices, and tablets among others is driving the increase.
● Embedded passive devices have a number of high-end qualities, including low power consumption, high chip connection, and small footprint, which have fueled their acceptance in miniaturized handheld electronics.
● The market for integrated passive devices in Asia-Pacific will grow from 2021 to 2028 owing to government measures to expand the production of semiconductors in the region.
● Gestamp, a Spanish multinational specializing in the development and manufacture of metal components for cars, will receive a €200 million loan from the European Investment Bank (EIB) to improve its research capacities in order to produce more lighter, safer and more environmentally friendly according to the Commission.
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