Electronic board level underfill and encapsulation materials are essential components in the manufacturing and assembly of electronic devices. Underfill materials are used to fill the gap between the die and the substrate, which enhances the mechanical strength and reliability of the device. Encapsulation materials, on the other hand, are used to protect the device from moisture, dust, and other contaminants that can cause malfunction or failure. These materials are usually applied in liquid form and cured to form a hard, protective layer around the electronic components.
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The selection of underfill and encapsulation materials is crucial to ensure the long-term reliability of electronic devices. Factors such as thermal stability, coefficient of thermal expansion, adhesion, and viscosity are critical in determining the suitability of these materials. Underfill materials must be able to withstand thermal cycling and maintain strong adhesion to the die and substrate. Encapsulation materials must have low moisture absorption, good adhesion to the substrate, and a high degree of mechanical strength.