Global Non-UV Dicing Tapes Market report from Global Insight Services is the single authoritative source of intelligence on Non-UV Dicing Tapes Market. The report will provide you with analysis of impact of latest market disruptions such as Russia-Ukraine war and Covid-19 on the market. Report provides qualitative analysis of the market using various frameworks such as Porters’ and PESTLE analysis. Report includes in-depth segmentation and market size data by categories, product types, applications, and geographies. Report also includes comprehensive analysis of key issues, trends and drivers, restraints and challenges, competitive landscape, as well as recent events such as M&A activities in the market.
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Non-UV Dicing Tapes are tapes that are used in the semiconductor industry for dicing and packaging applications. These tapes are made of polyimide or polyester and are coated with an adhesive that is designed to hold the semiconductor device in place during the dicing process. The tape is then removed after the device is diced and packaged.
The key trends in Non-UV Dicing Tapes technology are:
- The development of new materials for Non-UV Dicing Tapes.
- The development of new methods for applying Non-UV Dicing Tapes.
- The development of new methods for removing Non-UV Dicing Tapes.
- The development of new methods for testing Non-UV Dicing Tapes.
One of the key drivers of the non-UV dice tapes market is the rising demand for miniaturization of electronic devices. This is because miniaturization of electronic devices leads to reduced size and weight, increased portability, and enhanced functionality. In addition, miniaturization of electronic devices also helps in reducing the overall cost of the device. The other key driver of the non-UV dice tapes market is the increasing demand for high-density packaging. This is because high-density packaging helps in reducing the size of the electronic device and also helps in increasing the number of I/O pins.
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The Non-UV Dicing Tapes Market is segmented on the basis of material type, thickness, application, and region. On the basis of material type, it is divided into PVC, PET, PO, and others. Based on thickness, it is categorized into below 85 micron, 85-125 micron, 126-150 micron, and above 150 micron. On the basis of application, it is divided into wafer dicing and package dicing. Region-wise, the market is segmented into North America, Europe, Asia-Pacific, and the Rest of the World.
The Non-UV Dicing Tapes Market report includes players such asPantech Tape Co. Ltd., Furukawa Electric Co. Ltd., Mitsui Chemicals Inc., AI Technology, Inc., LINTEC Corporation, Pantech Tape Co. Ltd, Simac, Particles Plus, Inc., AMC CO.,LTD., and QES GROUP BERHAD.
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