Silver Sintering Paste is a kind of high silver-filled die attach paste, which can achieve ultra-high thermal conductivity. Silver sintered pastes offer a robust lead-free alternative to solder pastes increasing the lifetime of the device up to 10 times. It can be applied to printing or dispensing processes, which can ensure higher thermal conductivity in lead frame and LED packaging applications.
Global Thermal Conductivity Sintering Die Attach Adhesive market is projected to reach US$ 241.1 million in 2029, increasing from US$ 165 million in 2022, with the CAGR of 4.8% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Thermal Conductivity Sintering Die Attach Adhesive market research.
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Key manufacturers engaged in the Thermal Conductivity Sintering Die Attach Adhesive industry include Heraeus, Kyocera, Indium, Alpha Assembly Solutions, Henkel, Namics, Advanced Joining Technology, Shenzhen Facemoore Technology and Beijing Nanotop Electronic Technology, etc. Among those manufacturers, the top 3 players guaranteed % supply worldwide in 2022.
For production bases, global Thermal Conductivity Sintering Die Attach Adhesive production is dominated by and . The two regions contributed to % production share globally in 2022.
When refers to consumption region, % volume of Thermal Conductivity Sintering Die Attach Adhesive were sold to North America, Europe and Asia Pacific in 2022. Moreover, China, plays a key role in the whole Thermal Conductivity Sintering Die Attach Adhesive market and estimated to attract more attentions from industry insiders and investors.
Scope of Thermal Conductivity Sintering Die Attach Adhesive Market Report:
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Attention Deficit Hyperactivity Disorder (ADHD) Treatment market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
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Segment by Type:
- Pressure Sintering
- Pressure-less Sintering
Segment by Application:
- Power Semiconductor Device
- RF Power Device
- High Performance LED
- Others
Production by Region:
- North America
- Europe
- China
- Japan
Leading Key Players of Thermal Conductivity Sintering Die Attach Adhesive Market:
- Heraeus
- Kyocera
- Indium
- Alpha Assembly Solutions
- Henkel
- Namics
- Advanced Joining Technology
- Shenzhen Facemoore Technology
- Beijing Nanotop Electronic Technology
- TANAKA Precious Metals
- Nihon Superior
- Nihon Handa
- NBE Tech
- Solderwell Advanced Materials
- Guangzhou Xianyi Electronic Technology
- ShareX (Zhejiang) New Material Technology
- Bando Chemical Industries
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The Thermal Conductivity Sintering Die Attach Adhesive report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
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