Fan-Out Wafer Level Packaging (FOWLP) is a type of advanced packaging technology that is used to package integrated circuits (ICs) in a manner that allows for increased performance, greater functionality, and reduced cost. This technology is used to package ICs with a high density of I/O pins in a single package. FOWLP allows for the integration of multiple components into a single package, resulting in improved power and signal performance, increased packaging density, and reduced cost.
FOWLP is a process that uses a wafer-level approach to package ICs. In this process, a wafer is first etched to create a pattern of I/O pins. The pins are then connected to a substrate using a die-attach process. The substrate is then filled with a dielectric material, such as an epoxy, and then cured. After curing, the wafer is diced into individual chips. The chips are then mounted onto a substrate and connected using an adhesive.
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