Global Chiplets Market size and share is currently valued at USD 6.90 billion in 2023 and is anticipated to generate an estimated revenue of USD 1,660.65 billion by 2032, according to the latest study by Polaris Market Research. Besides, the report notes that the market exhibits a robust 83.9% Compound Annual Growth Rate (CAGR) over the forecasted timeframe, 2024 – 2032
Market Overview:
Chiplets represent a revolutionary approach to semiconductor design, addressing challenges in cost, power consumption, and performance. By allowing individual functional blocks (chiplets) to be manufactured independently and assembled together, this approach provides flexibility and efficiency. Industries such as data centers, telecommunications, and consumer electronics are among the primary adopters, leveraging chiplets for advanced computing and connectivity applications. The market is expected to witness substantial growth as manufacturers increasingly prioritize modularity and reusability in their designs.
Market’s Growth Drivers:
The growth of the chiplets market is driven by several critical factors:
Demand for High-Performance Computing (HPC):
With the rise of AI, machine learning, and cloud computing, there is an increasing demand for high-performance computing systems. Chiplets enable the creation of powerful processors that meet the computational requirements of these advanced applications.
Cost Efficiency in Manufacturing:
Traditional monolithic chips face high costs and low yields as process nodes shrink. Chiplets mitigate this challenge by enabling manufacturers to produce smaller, simpler dies at lower costs and combine them into advanced packages.
Advancements in Packaging Technologies:
Innovations in 2.5D and 3D packaging technologies have facilitated the seamless integration of chiplets, ensuring improved interconnectivity and performance while minimizing latency and energy consumption.
𝐆𝐞𝐭 𝐄𝐱𝐜𝐥𝐮𝐬𝐢𝐯𝐞 𝐒𝐚𝐦𝐩𝐥𝐞 𝐏𝐚𝐠𝐞𝐬 𝐨𝐟 𝐓𝐡𝐢𝐬 𝐑𝐞𝐩𝐨𝐫𝐭:
https://www.polarismarketresearch.com/industry-analysis/chiplets-market/request-for-sample
Some of the major players:
- Achronix Semiconductor Corporation (U.S.)
- Advanced Micro Devices, Inc. (AMD) (U.S.)
- Apple Inc. (U.S.)
- ASE Technology Holding Co., Ltd. (Taiwan)
- IBM (U.S.)
- Intel Corporation (U.S.)
- Marvell (U.S.)
- MediaTek (Taiwan)
- NVIDIA Corporation (U.S.)
- Ranovus (Canada)
Recent Developments in the Chiplets Industry:
- Marvell Joins Automotive Chiplet Initiative
In July 2023, Marvell announced its participation in the automotive chiplet initiative coordinated by imec. This initiative aims to tackle the design challenges associated with introducing multi-chiplet compute modules tailored for the automotive sector. By leveraging chiplet technology, the initiative seeks to enhance performance, scalability, and efficiency in automotive applications. - Eliyan Corporation Secures Significant Funding
In November 2022, Eliyan Corporation revealed that its innovative technology for multi-die chiplet integration attracted $40 million in Series A funding. This financial boost underscores the growing interest and investment in advancing chiplet integration technologies, enabling next-generation semiconductor solutions.
𝐒𝐞𝐠𝐦𝐞𝐧𝐭𝐚𝐥 𝐎𝐯𝐞𝐫𝐯𝐢𝐞𝐰:
The Chiplets Market segmentation divides the market into several segments. The industry segmentation is primarily based on product type, application, end-use, and geographic factors. Besides, the research study covers several sub-segments of the market. An in-depth examination of each market segment and sub-segment has been provided, covering the industry size, growth prospects, industry drivers, and challenges. The detailed market segmentation helps stakeholders identify the diverse needs of different consumer groups in the market. Also, it pinpoints opportunities for targeted marketing and product development strategies.
Chiplets Market, Processor Outlook (Revenue – USD Billion, 2019-2032)
- Field Programmable Gate Array (FPGA)
- Graphics Processing Unit (GPU)
- Central Processing Unit (CPU)
- Application Processing Unit (APU)
- Artificial Intelligence Application-Specific Integrated Circuit (AI-ASIC) Coprocessor
Chiplets Market, Packaging Technology Outlook (Revenue – USD Billion, 2019-2032)
- System in Package (SiP)
- Flip-Chip Chip Scale Package (FCCSP)
- Flip Chip Ball Grid Array (FCBGA)
- 2.5D/3D
- Wafer Level Chip Scale Package (WLCSP)
- Fan Out (FO)
Chiplets Market, Industry Vertical Outlook (Revenue – USD Billion, 2019-2032)
- Enterprise Electronics
- Consumer Electronics
- Automotive
- Industrial Automation
- Healthcare
- Military & Aerospace
- Others
The chiplets market represents a paradigm shift in semiconductor design, addressing critical challenges and opening new opportunities for innovation. As industries continue to demand more efficient and scalable solutions, chiplets stand out as a key enabler of future technologies. With ongoing advancements in packaging, standards development, and industry collaboration, the market is poised for sustained growth and transformative impact across various applications.