Global Chiplets Market size and share is currently valued at USD 6.90 billion in 2023 and is anticipated to generate an estimated revenue of USD 1,660.65 billion by 2032, according to the latest study by Polaris Market Research. Besides, the report notes that the market exhibits a robust 83.9% Compound Annual Growth Rate (CAGR) over the forecasted timeframe, 2024 – 2032
Market Overview:
Chiplets are small, modular integrated circuits designed to perform specific functions. Unlike traditional monolithic chips, chiplets allow for the integration of multiple functions into a single package without the need for developing a large, complex die. This approach enhances design flexibility, scalability, and cost-efficiency, making it a preferred choice for manufacturers addressing diverse application needs.
The chiplets market serves a wide range of industries, including data centers, telecommunications, automotive, consumer electronics, and aerospace. With the increasing complexity of applications such as AI workloads, 5G networks, and edge computing, chiplets are gaining traction as a versatile and efficient solution to meet growing computational demands.
Market Growth Drivers:
- Demand for High-Performance Computing (HPC)
The rise of data-intensive applications such as artificial intelligence, machine learning, and big data analytics is driving the adoption of chiplet-based architectures in HPC systems. - Cost Efficiency in Manufacturing
Chiplets allow manufacturers to reuse smaller, proven designs instead of creating entirely new monolithic chips, significantly reducing development costs and risks. - Advancements in Semiconductor Packaging
Innovations in advanced packaging technologies, such as 2.5D and 3D integration, are enabling the efficient assembly of chiplets, driving their adoption across industries. - Growth of AI and Machine Learning Applications
AI and machine learning require high computational power, which chiplet architectures can provide by integrating specialized processing units like GPUs, TPUs, and NPUs. - Need for Customization and Scalability
Chiplets offer the flexibility to customize and scale chip designs for specific applications, making them ideal for industries with rapidly evolving requirements.
Major Key Players:
- Advanced Micro Devices, Inc. (AMD) (U.S.)
- Apple Inc. (U.S.)
- ASE Technology Holding Co., Ltd. (Taiwan)
- IBM (U.S.)
- Intel Corporation (U.S.)
- Marvell (U.S.)
- MediaTek (Taiwan)
- NVIDIA Corporation (U.S.)
- Ranovus (Canada)
𝐄𝐱𝐩𝐥𝐨𝐫𝐞 𝐓𝐡𝐞 𝐂𝐨𝐦𝐩𝐥𝐞𝐭𝐞 𝐂𝐨𝐦𝐩𝐫𝐞𝐡𝐞𝐧𝐬𝐢𝐯𝐞 𝐑𝐞𝐩𝐨𝐫𝐭 𝐇𝐞𝐫𝐞:
https://www.polarismarketresearch.com/industry-analysis/chiplets-market
Recent Developments in the Industry:
- July 2023
Marvell announced its participation in the automotive chiplet initiative led by imec. This initiative aims to address the challenges of designing and implementing multi-chiplet compute modules tailored for the automotive industry, enabling advancements in automotive computing technology. - November 2022
Eliyan Corporation secured USD 40 million in a Series A funding round to support its technology for multi-die chiplet integration. The funding will accelerate the development and commercialization of its innovative solutions for chiplet-based architectures.
𝐒𝐞𝐠𝐦𝐞𝐧𝐭𝐚𝐥 𝐀𝐧𝐚𝐥𝐲𝐬𝐢𝐬:
The research study includes segmental analysis that divides the market into distinct groups or segments based on common characteristics. With market segmentation, businesses can identify specific customer groups that are more likely to be interested in specific products or services. Also, it enables these businesses to focus their marketing efforts and resources more efficiently, leading to higher conversion rates and improved return on investment. Furthermore, segmentation analysis helps companies develop personalized products or services, which can result in increased customer loyalty and improved customer satisfaction.
Chiplets Market, Processor Outlook (Revenue – USD Billion, 2019-2032)
- Field Programmable Gate Array (FPGA)
- Graphics Processing Unit (GPU)
- Central Processing Unit (CPU)
- Application Processing Unit (APU)
- Artificial Intelligence Application-Specific Integrated Circuit (AI-ASIC) Coprocessor
Chiplets Market, Packaging Technology Outlook (Revenue – USD Billion, 2019-2032)
- System in Package (SiP)
- Flip-Chip Chip Scale Package (FCCSP)
- Flip Chip Ball Grid Array (FCBGA)
- 2.5D/3D
- Wafer Level Chip Scale Package (WLCSP)
- Fan Out (FO)
Chiplets Market, Industry Vertical Outlook (Revenue – USD Billion, 2019-2032)
- Enterprise Electronics
- Consumer Electronics
- Automotive
- Industrial Automation
- Healthcare
- Military & Aerospace
- Others
The chiplets market is set to witness robust growth as industries increasingly adopt modular chip designs to address complex and evolving technological challenges. With advancements in packaging technologies and the development of open standards, chiplets are becoming more accessible and versatile, enabling their integration across a wide range of applications.