The thermal interface materials market is growing due to increasing demand for efficient heat dissipation solutions in electronics, electric vehicles, and renewable energy systems. Advancements in materials, such as graphene-based TIMs and phase change materials, are improving thermal conductivity and performance. The expanding adoption of electric vehicles and advancements in power electronics are significant drivers. Additionally, renewable energy systems like solar panels and wind turbines require high-performance TIMs for improved efficiency.
According to the research report, the global thermal interface materials market was valued at USD 1.89 billion in 2021 and is expected to reach USD 4.75 billion by 2030, to grow at a CAGR of 11.3% during the forecast period.
Key Market Trends:
Thermal Interface Materials (TIMs)
- Growing demand from the electronics industry for effective heat dissipation in devices like smartphones, laptops, and EV batteries.
- Rising adoption in renewable energy systems, including solar panels and wind turbines.
- Development of advanced TIMs like graphene-based and phase change materials for higher thermal conductivity.
- Increasing use in automotive applications, especially in electric vehicles and powertrain systems.
- Technological advancements for thinner, more efficient, and durable materials.
Key Companies in Thermal Interface Materials Market:
- Bergquist Company
- Hannifin Corporation
- Henkel AG
- Honeywell International Inc.
- Indim Corporation
- Laird Technologies
- LORD Corporation
- Master Bond Inc.
- Momentive Performance Materials
- Parker Chomerics
- Shin-Etsu
- The 3M Company
- The Dow Chemical Company
- Wakefield-Vette
- Zalman Tech Corporation Ltd
Growth Factors:
• Market dynamics:All the key factors and major developments anticipated to boost the growth of the market are covered in the study.
• Technological evolution:The report offers a thorough understanding of the emerging technologies that can influence the Thermal Interface Materials market demand.
• Innovation pathways: The study covers where innovations can take the market in the mid to long term.
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The Geographical Analysis Covers Following Key Regions:
• North America (United States, Canada, and Mexico)
• Europe (Germany, France, United Kingdom, Russia, Italy, and the Rest of Europe)
• Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
• South America (Brazil, Argentina, Colombia, and the rest of South America)
• The Middle East and Africa (Saudi Arabia, United Arab Emirates, Egypt, South Africa, and the Rest of the Middle East and Africa)
Thermal Interface Materials Market Segmentation:
The TIMs market is segmented by type, application, and region. Types include adhesives, greases & gels, tapes, and phase change materials, with greases & gels dominating for electronics applications. Applications cover consumer electronics, automotive, and renewable energy, with electronics leading due to heat management needs. North America and Asia-Pacific dominate, driven by advancements in electronics and electric vehicle manufacturing.
Thermal Interface Materials Market, Composition Outlook (Revenue – USD Billion, 2018 – 2030)
- Epoxy
- Polyimide
- Silicone
- Others
Thermal Interface Materials Market, Type Outlook (Revenue – USD Billion, 2018 – 2030)
- Tapes And Films
- Elastomeric Pads
- Greases & Adhesives
- Phase Change Materials
- Metal Based Thermal Interface Materials
- Others
Thermal Interface Materials Market, Application Outlook (Revenue – USD Billion, 2018 – 2030)
- Computers
- Medical Devices
- Telecom
- Automotive Electronics
- Consumer Durables
- Industrial Machinery
- Others
Thermal Interface Materials Industry Developments:
In June 2022, Dow Corning Corporation launched DOWSIL TC-4040 dispensable thermal pad, offering high thermal conductivity and resistance to slumping. This new product aims to expand the company’s product range and meet the growing demand from consumers in the thermal management market.
In April 2021, Parker Hannifin Corporation introduced THERM-A-GAP GEL 75, a single-component dispensable thermal interface material designed for high-powered electronics. Suitable for applications in automotive safety electronics, memory and power modules, telecommunications equipment, and power supplies, this product enhances thermal management in critical electronic components.
In May 2022, Arieca partnered with ROHM Co., Ltd. through a joint research agreement to develop next-generation thermal interface materials for the xEV market. The research focuses on utilizing Arieca’s Liquid Metal Embedded Elastomer Technology to develop advanced SiC power modules for electric vehicle applications.
In March 2024, Resonac Corporation announced plans to increase its production capacity by 3.5 to 5 times its current level. The company aims to manufacture materials for high-performance semiconductor chips, especially for AI CPUs, and to ramp up production of thermal interface materials (TIM) and non-conductive films (NCF).
In February 2023, Indium Corporation introduced its metal thermal interface materials (TIMs) with high performance for testing and burn-in at TestConX. With pure indium offering 86W/mK thermal conductivity, Indium’s TIMs outperform non-metal alternatives in thermal management.
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