A 3D IC is a three-dimensional integrated circuit, metal-oxide-semiconductor (MOS) integrated circuit manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two-dimensional processes. The 3D IC is one of the several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics. 3D integrated circuits can be classified by their level of interconnect hierarchy at the global package, intermediate, and local transistor level. In general 3D integration is a broad term that includes such technologies as 3D wafer-level packaging, 2.5 D and 3D interposer-based integration, and 3D system integration, as well as true monolithic 3D ICs.
International organizations such as the Jisso Technology Roadmap Committee (JIC) and the International Technology Roadmap for Semiconductors have worked to classify the various 3D integration technologies to further the establishment of standards and roadmaps of 3D integration. As of the 2010s, 3D ICs are widely used for NAND flash memory and mobile devices.
3D ICs are ideal for all kinds of chips that target more transistors, less power, or small areas. A multitude of different chip segments have different advantages from 3D IC technology and 3D ICs are finding increasing acceptance in some of the most demanding semiconductor applications. 3D ICs address the scaling challenge by stacking 2D dies and connecting them in the 3rd dimension. This promises the speed up communication between layered chips, compared to the planer layout.
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Global 3D ICs Market – Competitive Landscape
On July 15, 2022, ChipMOS Technologies Inc. pledged to invest USD 418.2 million in expanding capacity in Taiwan, which approved the driver IC and memory chip tester. On February 16, 2022, ETH Zurich spin-out Scrona AG raised USD 9.6 million towards the development of a novel high-resolution approach to 3D printing electronic devices. On May 25, 2021, EYs3D Microelectronics, a fabless design house that focuses on end-to-end software and hardware systems for computer vision technology, raised a USD 7 million series A.
Some of the Key Players in the Global 3D ICs Market Include –
- Samsung
- Taiwan Semiconductor Manufacturing Company, LTD
- Intel Corporation
- ASE Technology Holding Co. LTD
- Amkor Technology
- Broadcom
- Texas Instruments Inc.
- Monolithic 3D Inc.
- Elpida Memory
- United Microelectronics Corporation
Global 3D ICs Market – Growth Drivers
3d IC technology allows for stacking multiple layers of integrated circuits, leading to improved performance and speed in electronic devices. As consumer electronics demand smaller and more compact devices, 3D ICs enable higher component density, contributing to the miniaturization of products. 3D ICs can reduce power consumption by optimizing interconnect length and enhancing energy efficiency in electronic devices. The ability to integrate different types of devices and technologies in a vertically stacked configuration enables the creation of more complex and feature-rich systems. The vertically stacked architecture in 3D ICs allows for shorter interconnects, leading to faster data transfer rates and increased bandwidth. The stacking of diverse functionalities in a compact space facilitates the development of more sophisticated and multifunctional electronic systems. The growth of emerging technologies such as the Internet of Things (IoT), artificial intelligence, and 5G networks is driving the demand for advanced semiconductor solutions, including 3D ICs. Despite initial challenges, advancements in manufacturing processes for 3D ICs have the potential to reduce production costs, making them more attractive to manufacturers.
Global 3D ICs Market – Restraints
The manufacturing process for 3D ICs can be expensive and complex, posing a barrier to widespread adoption, especially for smaller companies with limited resources. Designing integrated circuits in a three-dimensional space introduces new challenges, such as managing heat dissipation, signal integrity, and interlayer communication which can hinder the development process. Despite advancements, 3D IC technology is still evolving. Its relative immaturity compared to traditional 2D ICs can make some industries hesitant to fully embrace the technology. The lack of standardized processes and interfaces for 3D ICs can create compatibility issues and hinder interoperability between different manufacturers and components. Testing three-dimensional structures is more complex than traditional methods, leading to challenges in ensuring the reliability and quality of 3D ICs, which can impact trust in the technology. dependencies on specialized manufacturing processes and materials may make the supply chain vulnerable to disruption, impacting the consistent availability of 3D IC components.
Global 3D ICs Market – Opportunities
The demand for higher performance in electronic devices provides an opportunity for 3D ICs to become a preferred solution due to their ability to deliver improved speed and functionality. As consumer electronics continue to trend toward smaller and more compact designs, the miniaturization potential of 3D ICs positions them favorably in meeting the market demand for smaller form factors. The demand for high-performance computing-intensive applications creates opportunities for 3D ICs to provide improved processing power and energy efficiency. The medical field’s growing need for compact and efficient electronic devices for diagnostics, monitoring, and treatment offers opportunities for 3D ICs to contribute to advancements in healthcare technology.
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Global 3D ICs Market – Geographical Insight
The market for 3D ICs is segmented into regions such as North America, Latin America, Europe, Asia-Pacific, the Middle East & Africa. North America is the largest region for the 3D IC market due to the strong presence of leading semiconductor companies and research institutions driving innovation and adoption of 3D IC technology. High demand for advanced electronics in sectors like aerospace, defense, and data centers contributes to market growth. In Asia-Pacific dominance in semiconductor manufacturing particularly in countries like Taiwan and South Korea, positions the region as a key player in 3D IC production. In Europe, the robust automotive and industrial sectors create opportunities for 3D ICs in applications like advanced driver-assistance systems and industrial automation.
Global 3D ICs Market – Key Development
- On November 13, 2023, Samsung Electronics is gearing up to introduce a new advanced 3D chip packaging technology named SAINT in a bid to rival Taiwan semiconductor manufacturing company’s market dominance.
- On September 28, 2023, TSMC 2023 OIP Ecosystem Forum, announced the new 3Dblox 2.0 open standard and major achievement of its Open Innovation Platform 3D fabric alliance.
- On August 13, 2020, Samsung Electronics announced that its silicon-proven 3D IC packaging technology, dubbed eXtended-cube, is now available to customers.