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Cognizance Market Research

Global 3D IC Market to Skyrocket to US$85.3 Billion by 2032, Driven by AI, IoT, and High-Performance Computing Demands at 22.2% CAGR

June 1, 2025 by Cognizance Market Research

A 3D IC is a three-dimensional integrated circuit, metal-oxide-semiconductor (MOS) integrated circuit manufactured by stacking as many as 16 or more ICs and interconnecting them …

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Categories News Tags 3D Ic, 3D ICs Market, Advanced Packaging, AI chips, Amkor Technology, ASE Technology, heterogeneous integration, Intel, IoT, mobile devices, NAND flash, Samsung, Semiconductor Packaging, Three-Dimensional Integrated Circuits, Through-Silicon Vias, TSMC, TSV

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